Presentation
| Product range | RF-KB11 |
| Product type | BGA Instrument |
Sale package
| Pack | Blister |
| Content | BGA Instrument / Blades |
| Product status | New |
BGA Tool RF4 RF-KB11
The RF4 RF-KB11 tool is a professional solution for delicate BGA operations, standing out through the innovative stepped 3D blade design.
This special structure was designed to perfectly balance the hardness required for cutting with the flexibility demanded by fragile electronic components.
The blade edge features an inclined surface, finished by manual polishing in multiple thickness layers, allowing you
to remove adhesive or lift integrated circuits without scratching the motherboard or damaging the solder points.
As a tool that emphasizes circuit protection, the RF-KB11 offers you the finesse needed
to work efficiently on flat surfaces while maintaining the integrity of electrical contacts.
Features:
- Blade design: 3D profile with stepped structure for increased durability;
- Performance: Combines high hardness with optimized flexibility;
- Usage: Ideal for adhesive cleaning, lifting integrated circuits, and BGA repairs;
- Quality: Durable materials that maintain sharpness over time.